Board development for IoT nodes

In order to increase the robustness of the IoT nodes, circuit boards for the IoT nodes were developed in cooperation with the electronics workshop of the TU Kaiserslautern. The boards replace the breadboard that was used in the first prototype. The IoT node consists of a motherboard for the microprocessor and module boards with which the node can be adapted to use different sensors. We would like to thank the electronics workshop in particular for the great support!

Grundplatine IoT-Knoten
Grundplatine mit aufgesteckten Modulplatinen